Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018083 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2021-05-25 |
| 11004812 | Package structure and method of forming the same | Hung-Jui Kuo, Hsin-Yu Pan, Ming-Che Ho, Tzu-Yun Huang, Yen-Fu Su | 2021-05-11 |