Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ming-Kai Liu +5 more | 2021-12-28 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11018083 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2021-05-25 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10950556 | EMI shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Meng-Tse Chen | 2021-03-16 |