Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2021-08-24 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10964595 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2021-03-30 |