Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171109 | Techniques for forming semiconductor device packages and related packages, intermediate products, and methods | Po Chih Yang, Yu-Jen Chen, Po Chen Kuo | 2021-11-09 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 10985117 | Solder ball protection in packages | Chia-Chun Miao, Kai-Chiang Wu | 2021-04-20 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2021-04-06 |