Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195864 | Flip-chip sample imaging devices with self-aligning lid | Ming Zhang, Yin Qian, Dyson H. Tai | 2021-12-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2021-08-24 |
| 10985117 | Solder ball protection in packages | Shih-Wei Liang, Kai-Chiang Wu | 2021-04-20 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2021-04-06 |
| 10892290 | Interconnect layer contact and method for improved packaged integrated circuit reliability | Yin Qian, Ming Zhang, Dyson H. Tai | 2021-01-12 |