Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11127708 | Package structure and method of manufacturing the same | Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11101238 | Surface mounting semiconductor components | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2021-07-27 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10964595 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2021-03-30 |