Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2021-12-28 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11183461 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2021-11-23 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Han-Ping Pu, Kai-Chiang Wu, Nan-Chin Chuang | 2021-10-12 |
| 11114357 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2021-05-11 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |