Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2021-10-12 |
| 11043731 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2021-06-22 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu | 2021-05-11 |
| 10998016 | Memory device including noise-suppressing mechanism | Chin-Yuan Lo, Ting-Ying Wu, Hsin-Hui Lo | 2021-05-04 |