Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195864 | Flip-chip sample imaging devices with self-aligning lid | Ming Zhang, Chia-Chun Miao, Dyson H. Tai | 2021-12-07 |
| 11089067 | Progressive rendering | Xiao Xia Mao, Zhen Hong Ding, Dong Ni | 2021-08-10 |
| 11019016 | Subgroup messaging within a group-based messaging interface | Yuan Jin, Xiao Cao Cao, Xin Zhao | 2021-05-25 |
| 10892290 | Interconnect layer contact and method for improved packaged integrated circuit reliability | Chia-Chun Miao, Ming Zhang, Dyson H. Tai | 2021-01-12 |