Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177237 | Manufacturing method of semiconductor package | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2021-11-16 |
| 11150458 | Multi-mode imaging optical system | Chao-Wei Li, Meng LV, Feng Chen, Yaohua Du, Zhi Cheng +1 more | 2021-10-19 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 10950556 | EMI shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang | 2021-03-16 |