Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133265 | Integrated fan-out package and method of fabricating the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-09-28 |
| 11114313 | Wafer level mold chase | Hsien-Wen Liu, Po-Hao Tsai, Shin-Puu Jeng | 2021-09-07 |
| 11101214 | Package structure with dam structure and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2021-08-24 |
| 11094625 | Semiconductor package with improved interposer structure | Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2021-08-17 |
| 11024581 | Semiconductor packages and methods of manufacturing the same | Hung-Jui Kuo, Ming-Che Ho | 2021-06-01 |
| 10930586 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2021-02-23 |