ML

Meng-Liang Lin

TSMC: 3 patents #860 of 3,494Top 25%
Overall (2021): #70,957 of 548,734Top 15%
3
Patents 2021

Issued Patents 2021

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11164754 Fan-out packages and methods of forming the same Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang +2 more 2021-11-02
11101214 Package structure with dam structure and method for forming the same Po-Hao Tsai, Techi Wong, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng 2021-08-24
11075151 Fan-out package with controllable standoff Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Po-Yao Chuang, Shin-Puu Jeng 2021-07-27