Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng +2 more | 2021-12-14 |
| 11164754 | Fan-out packages and methods of forming the same | Po-Hao Tsai, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang, Meng-Liang Lin +2 more | 2021-11-02 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Po-Hao Tsai, Po-Yao Chuang | 2021-07-13 |
| 10971461 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2021-04-06 |