Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164754 | Fan-out packages and methods of forming the same | Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang +2 more | 2021-11-02 |
| 11107801 | Multi fan-out package structure and method for forming the same | Shin-Puu Jeng, Shuo-Mao Chen, Feng-Cheng Hsu, Chia-Hsiang Lin | 2021-08-31 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2021-07-13 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |