Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205603 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2021-12-21 |
| 11189596 | Methods of forming multi-chip wafer level packages | Shuo-Mao Chen, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2021-11-30 |
| 11164829 | Method of forming contact holes in a fan out package | Szu-Wei Lu, Jing-Cheng Lin | 2021-11-02 |
| 11152316 | Method of forming contact holes in a fan out package | Szu-Wei Lu, Jing-Cheng Lin | 2021-10-19 |
| 11107801 | Multi fan-out package structure and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Chia-Hsiang Lin | 2021-08-31 |
| 11069656 | Three-layer package-on-package structure and method forming same | Jui-Pin Hung, Shin-Puu Jeng | 2021-07-20 |
| 11063023 | Semiconductor package | Jui-Pin Hung, Shin-Puu Jeng | 2021-07-13 |
| 11018106 | Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof | Jing-Cheng Lin | 2021-05-25 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Shuo-Mao Chen, Techi Wong | 2021-04-20 |
| 10971483 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Jui-Pin Hung | 2021-04-06 |