Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189596 | Methods of forming multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2021-11-30 |
HH
Han-Hsiang Huang
Overall (2021): #440,739 of 548,734Top 85%
1
Patents 2021