Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189596 | Methods of forming multi-chip wafer level packages | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2021-11-30 |
| 11107801 | Multi fan-out package structure and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chia-Hsiang Lin | 2021-08-31 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2021-06-15 |
| 11023647 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2021-06-01 |
| 11004818 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2021-05-11 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2021-04-20 |
| 10971441 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2021-04-06 |