Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2021-11-09 |
| 11075132 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Tzu-Jui Fang, Po-Yao Chuang | 2021-07-27 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |