Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2021-11-09 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, Tzu-Hung Lin | 2021-01-26 |