Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin | 2021-11-09 |
| 10990744 | Method and apparatus for integrated circuit mask patterning | Chin-Min Huang, Bo-Han Chen, Cherng-Shyan Tsay, Chien-Wen Lai, Hua-Tai Lin +2 more | 2021-04-27 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | I-Hsuan Peng, Tzu-Hung Lin | 2021-01-26 |