Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081453 | Semiconductor package structure with antenna | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-01 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2021-03-23 |