Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081453 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2021-06-01 |
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Nan-Cheng Chen | 2021-04-27 |
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Jen-Chuan Chen, Hsueh-Te Wang | 2021-04-13 |
| 10916449 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2021-02-09 |