Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081453 | Semiconductor package structure with antenna | Nai-Wei Liu, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2021-06-01 |
| 10943873 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu | 2021-03-09 |