Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2021-11-09 |
| 11121108 | Flip chip package utilizing trace bump trace interconnection | Thomas Matthew Gregorich | 2021-09-14 |
| 11081453 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu | 2021-06-01 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, I-Hsuan Peng | 2021-01-26 |