Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121108 | Flip chip package utilizing trace bump trace interconnection | Tzu-Hung Lin | 2021-09-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121108 | Flip chip package utilizing trace bump trace interconnection | Tzu-Hung Lin | 2021-09-14 |