Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Jen-Chuan Chen, Wen-Sung Hsu | 2021-04-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Jen-Chuan Chen, Wen-Sung Hsu | 2021-04-13 |