Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Hsueh-Te Wang, Wen-Sung Hsu | 2021-04-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Hsueh-Te Wang, Wen-Sung Hsu | 2021-04-13 |