Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Wen-Sung Hsu | 2021-04-27 |
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Skip to contentShowing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Wen-Sung Hsu | 2021-04-27 |