Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Wen-Sung Hsu | 2021-04-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991669 | Semiconductor package using flip-chip technology | Che-Ya Chou, Wen-Sung Hsu | 2021-04-27 |