Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205588 | Interconnect architecture with enhanced reliability | Baozhen Li, Chih-Chao Yang | 2021-12-21 | $5,237,000 |
| 11133268 | Crack bifurcation in back-end-of-line | Tuhin Sinha | 2021-09-28 | $6,479,000 |
| 11011415 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Matthew S. Angyal | 2021-05-18 | $4,116,000 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Jim Shih-Chun Liang, Baozhen Li, Ning Lu | 2021-05-04 | $7,263,000 |