Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11204379 | Structures and methods for RF de-embedding | Robert A. Groves, Christopher S. Putnam, Eric Thompson | 2021-12-21 | $5,237,000 |
| 11074386 | Method of parameter creation | Eric A. Foreman, Jeffrey G. Hemmett | 2021-07-27 | $4,187,000 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Jim Shih-Chun Liang, Naftali E. Lustig, Baozhen Li | 2021-05-04 | $7,263,000 |
| 10892428 | Flexible substrate and manufacturing method thereof | Wei Zhang | 2021-01-12 |