| 11205588 |
Interconnect architecture with enhanced reliability |
Chih-Chao Yang, Naftali E. Lustig |
2021-12-21 |
| 11195751 |
Bilayer barrier for interconnect and memory structures formed in the BEOL |
Chih-Chao Yang |
2021-12-07 |
| 11177213 |
Embedded small via anti-fuse device |
Chih-Chao Yang, Tianji Zhou, Ashim Dutta, Saumya Sharma |
2021-11-16 |
| 11171063 |
Metalization repair in semiconductor wafers |
Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II |
2021-11-09 |
| 11171064 |
Metalization repair in semiconductor wafers |
Lawrence A. Clevenger, Kirk D. Peterson, John E. Sheets, II |
2021-11-09 |
| 11164878 |
Interconnect and memory structures having reduced topography variation formed in the BEOL |
Chih-Chao Yang, Raghuveer R. Patlolla, Cornelius Brown Peethala |
2021-11-02 |
| 11152300 |
Electrical fuse with metal line migration |
Yan Li, Keith Kwong Hon Wong, Chih-Chao Yang |
2021-10-19 |
| 11145591 |
Integrated circuit (IC) device integral capacitor and anti-fuse |
Jim Shih-Chun Liang, Chih-Chao Yang |
2021-10-12 |
| 11145543 |
Semiconductor via structure with lower electrical resistance |
Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang |
2021-10-12 |
| 11133462 |
Bottom electrode structure and method of forming the same |
Chih-Chao Yang, Andrew Tae Kim |
2021-09-28 |
| 11121082 |
Sub-ground rule e-Fuse structure |
Andrew Tae Kim, Chih-Chao Yang, Ernest Y. Wu |
2021-09-14 |
| 11101213 |
EFuse structure with multiple links |
Chih-Chao Yang, Jim Shih-Chun Liang, Tian Shen |
2021-08-24 |
| 11099230 |
Electromigration test structures for void localization |
Chih-Chao Yang |
2021-08-24 |
| 11062993 |
Contacts having a geometry to reduce resistance |
Lawrence A. Clevenger, Kirk D. Peterson, Terry A. Spooner, Junli Wang |
2021-07-13 |
| 11031457 |
Low resistance high capacitance density MIM capacitor |
Chih-Chao Yang |
2021-06-08 |
| 10998263 |
Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device |
Jim Shih-Chun Liang, Naftali E. Lustig, Ning Lu |
2021-05-04 |
| 10971447 |
BEOL electrical fuse |
Chih-Chao Yang, Andrew Tae Kim |
2021-04-06 |
| 10964647 |
Dielectric crack stop for advanced interconnects |
Chih-Chao Yang, Griselda Bonilla |
2021-03-30 |
| 10957657 |
Advanced crack stop structure |
Chih-Chao Yang, Xiao Hu Liu, Griselda Bonilla |
2021-03-23 |
| 10943972 |
Precision BEOL resistors |
Kirk D. Peterson, John E. Sheets, II, Lawrence A. Clevenger, Junli Wang, Chih-Chao Yang |
2021-03-09 |
| 10930589 |
Advanced interconnects containing an IMT liner |
Joseph F. Maniscalco, Andrew Tae Kim, Chih-Chao Yang |
2021-02-23 |
| 10923575 |
Low resistance contact for transistors |
Lawrence A. Clevenger, Junli Wang, Kirk D. Peterson, Terry A. Spooner, John E. Sheets, II |
2021-02-16 |
| 10903117 |
Fabricating vias with lower resistance |
Chih-Chao Yang, Andrew Tae Kim |
2021-01-26 |
