| 11205678 |
Embedded MRAM device with top via |
Ekmini Anuja De Silva, Dominik Metzler |
2021-12-21 |
$5,237,000 |
| 11189783 |
Embedded MRAM device formation with self-aligned dielectric cap |
John C. Arnold, Dominik Metzler, Donald F. Canaperi |
2021-11-30 |
$2,996,000 |
| 11189561 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric |
Ekmini Anuja De Silva, Dominik Metzler, John C. Arnold |
2021-11-30 |
$2,996,000 |
| 11189527 |
Self-aligned top vias over metal lines formed by a damascene process |
Timothy Mathew Philip, Sagarika Mukesh, Dominik Metzler, John C. Arnold |
2021-11-30 |
$2,996,000 |
| 11177213 |
Embedded small via anti-fuse device |
Chih-Chao Yang, Baozhen Li, Tianji Zhou, Saumya Sharma |
2021-11-16 |
$1,912,000 |
| 11158786 |
MRAM device formation with controlled ion beam etch of MTJ |
Chih-Chao Yang, Lijuan Zou, John C. Arnold |
2021-10-26 |
$2,874,000 |
| 11152261 |
Self-aligned top via formation at line ends |
John C. Arnold, Dominik Metzler |
2021-10-19 |
$2,168,000 |
| 11133195 |
Inverse tone pillar printing method using polymer brush grafts |
Nelson Felix, Ekmini Anuja De Silva, Praveen Joseph |
2021-09-28 |
$6,479,000 |
| 11133260 |
Self-aligned top via |
Chi-Chun Liu, John C. Arnold, Dominik Metzler, Nelson Felix |
2021-09-28 |
$6,479,000 |
| 11121173 |
Preserving underlying dielectric layer during MRAM device formation |
Michael Rizzolo |
2021-09-14 |
$2,674,000 |
| 11081643 |
Bevel metal removal using ion beam etch |
Saba Zare, Michael Rizzolo, Theodorus E. Standaert, Daniel C. Edelstein |
2021-08-03 |
$4,187,000 |
| 11081388 |
Forming barrierless contact |
Kisik Choi, Koichi Motoyama, Iqbal Rashid Saraf, Benjamin D. Briggs |
2021-08-03 |
$4,187,000 |
| 11062946 |
Self-aligned contact on a semiconductor device |
Jennifer Church, Ekmini Anuja De Silva, Luciana Meli Thompson |
2021-07-13 |
$4,436,000 |
| 11043628 |
Multi-layer bottom electrode for embedded memory devices |
Ekmini Anuja De Silva |
2021-06-22 |
$6,016,000 |
| 10957850 |
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication |
Isabel Cristina Chu, Son V. Nguyen, Michael Rizzolo, John C. Arnold |
2021-03-23 |
$2,115,000 |
| 10892404 |
Sacrificial buffer layer for metal removal at a bevel edge of a substrate |
Saba Zare, Michael Rizzolo, Theodorus E. Standaert, Daniel C. Edelstein |
2021-01-12 |
$3,912,000 |
| 10886462 |
Encapsulated memory pillars |
Ekmini Anuja De Silva, Jennifer Church, Luciana Meli Thompson |
2021-01-05 |
$2,293,000 |
