Issued Patents 2021
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205678 | Embedded MRAM device with top via | Ekmini Anuja De Silva, Dominik Metzler | 2021-12-21 |
| 11189783 | Embedded MRAM device formation with self-aligned dielectric cap | John C. Arnold, Dominik Metzler, Donald F. Canaperi | 2021-11-30 |
| 11189561 | Placing top vias at line ends by selective growth of via mask from line cut dielectric | Ekmini Anuja De Silva, Dominik Metzler, John C. Arnold | 2021-11-30 |
| 11189527 | Self-aligned top vias over metal lines formed by a damascene process | Timothy Mathew Philip, Sagarika Mukesh, Dominik Metzler, John C. Arnold | 2021-11-30 |
| 11177213 | Embedded small via anti-fuse device | Chih-Chao Yang, Baozhen Li, Tianji Zhou, Saumya Sharma | 2021-11-16 |
| 11158786 | MRAM device formation with controlled ion beam etch of MTJ | Chih-Chao Yang, Lijuan Zou, John C. Arnold | 2021-10-26 |
| 11152261 | Self-aligned top via formation at line ends | John C. Arnold, Dominik Metzler | 2021-10-19 |
| 11133195 | Inverse tone pillar printing method using polymer brush grafts | Nelson Felix, Ekmini Anuja De Silva, Praveen Joseph | 2021-09-28 |
| 11133260 | Self-aligned top via | Chi-Chun Liu, John C. Arnold, Dominik Metzler, Nelson Felix | 2021-09-28 |
| 11121173 | Preserving underlying dielectric layer during MRAM device formation | Michael Rizzolo | 2021-09-14 |
| 11081643 | Bevel metal removal using ion beam etch | Saba Zare, Michael Rizzolo, Theodorus E. Standaert, Daniel C. Edelstein | 2021-08-03 |
| 11081388 | Forming barrierless contact | Kisik Choi, Koichi Motoyama, Iqbal Rashid Saraf, Benjamin D. Briggs | 2021-08-03 |
| 11062946 | Self-aligned contact on a semiconductor device | Jennifer Church, Ekmini Anuja De Silva, Luciana Meli Thompson | 2021-07-13 |
| 11043628 | Multi-layer bottom electrode for embedded memory devices | Ekmini Anuja De Silva | 2021-06-22 |
| 10957850 | Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication | Isabel Cristina Chu, Son V. Nguyen, Michael Rizzolo, John C. Arnold | 2021-03-23 |
| 10892404 | Sacrificial buffer layer for metal removal at a bevel edge of a substrate | Saba Zare, Michael Rizzolo, Theodorus E. Standaert, Daniel C. Edelstein | 2021-01-12 |
| 10886462 | Encapsulated memory pillars | Ekmini Anuja De Silva, Jennifer Church, Luciana Meli Thompson | 2021-01-05 |