KC

Kisik Choi

IBM: 13 patents #288 of 11,638Top 3%
Overall (2021): #4,749 of 548,734Top 1%
13
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11195792 Top via stack Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Robert R. Robison 2021-12-07
11195753 Tiered-profile contact for semiconductor Kangguo Cheng 2021-12-07
11195795 Well-controlled edge-to-edge spacing between adjacent interconnects Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2021-12-07
11189568 Top via interconnect having a line with a reduced bottom dimension Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2021-11-30
11177166 Etch stop layer removal for capacitance reduction in damascene top via integration Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Robert R. Robison, Nicholas Anthony Lanzillo 2021-11-16
11171084 Top via with next level line selective growth Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Robert R. Robison 2021-11-09
11164815 Bottom barrier free interconnects without voids Kenneth Chun Kuen Cheng, Koichi Motoyama, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee 2021-11-02
11164777 Top via with damascene line and via Lawrence A. Clevenger, Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2021-11-02
11158537 Top vias with subtractive line formation Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison 2021-10-26
11081388 Forming barrierless contact Koichi Motoyama, Ashim Dutta, Iqbal Rashid Saraf, Benjamin D. Briggs 2021-08-03
10943990 Gate contact over active enabled by alternative spacer scheme and claw-shaped cap Andrew M. Greene, Victor Chan, Gangadhara Raja Muthinti, Veeraraghavan S. Basker, Junli Wang +1 more 2021-03-09
10892195 Method and structure for forming a vertical field-effect transistor using a replacement metal gate process Choonghyun Lee, Kangguo Cheng 2021-01-12
10886183 Method and structure for forming a vertical field-effect transistor using a replacement metal gate process Choonghyun Lee, Kangguo Cheng 2021-01-05