| 11177169 |
Interconnects with gouged vias |
Kenneth Chun Kuen Cheng, Koichi Motoyama, Chih-Chao Yang |
2021-11-16 |
| 11177167 |
Ultrathin multilayer metal alloy liner for nano Cu interconnects |
Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami +2 more |
2021-11-16 |
| 11177162 |
Trapezoidal interconnect at tight BEOL pitch |
Nicholas Anthony Lanzillo, Huai Huang, Junli Wang, Koichi Motoyama, Christopher J. Penny +1 more |
2021-11-16 |
| 11164815 |
Bottom barrier free interconnects without voids |
Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Joe Lee |
2021-11-02 |
| 11152257 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more |
2021-10-19 |
| 11152299 |
Hybrid selective dielectric deposition for aligned via integration |
Nicholas Anthony Lanzillo, Christopher J. Penny, Lawrence A. Clevenger, Robert R. Robison |
2021-10-19 |
| 11101175 |
Tall trenches for via chamferless and self forming barrier |
Yann Mignot, Chih-Chao Yang |
2021-08-24 |
| 11056426 |
Metallization interconnect structure formation |
Yann Mignot, Hsueh-Chung Chen, Chih-Chao Yang |
2021-07-06 |
| 10964588 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo |
2021-03-30 |
| 10943866 |
Method and structure to construct cylindrical interconnects to reduce resistance |
Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger |
2021-03-09 |
| 10903116 |
Void-free metallic interconnect structures with self-formed diffusion barrier layers |
Joseph F. Maniscalco, Koichi Motoyama, James J. Kelly, Chih-Chao Yang |
2021-01-26 |
