Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177169 | Interconnects with gouged vias | Kenneth Chun Kuen Cheng, Koichi Motoyama, Chih-Chao Yang | 2021-11-16 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami +2 more | 2021-11-16 |
| 11177162 | Trapezoidal interconnect at tight BEOL pitch | Nicholas Anthony Lanzillo, Huai Huang, Junli Wang, Koichi Motoyama, Christopher J. Penny +1 more | 2021-11-16 |
| 11164815 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Joe Lee | 2021-11-02 |
| 11152257 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more | 2021-10-19 |
| 11152299 | Hybrid selective dielectric deposition for aligned via integration | Nicholas Anthony Lanzillo, Christopher J. Penny, Lawrence A. Clevenger, Robert R. Robison | 2021-10-19 |
| 11101175 | Tall trenches for via chamferless and self forming barrier | Yann Mignot, Chih-Chao Yang | 2021-08-24 |
| 11056426 | Metallization interconnect structure formation | Yann Mignot, Hsueh-Chung Chen, Chih-Chao Yang | 2021-07-06 |
| 10964588 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo | 2021-03-30 |
| 10943866 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger | 2021-03-09 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, Koichi Motoyama, James J. Kelly, Chih-Chao Yang | 2021-01-26 |