| 11195993 |
Encapsulation topography-assisted self-aligned MRAM top contact |
Michael Rizzolo, Nicholas Anthony Lanzillo, Lawrence A. Clevenger |
2021-12-07 |
$3,115,000 |
| 11164377 |
Motion-controlled portals in virtual reality |
Aldis Sipolins, Lawrence A. Clevenger, Michael Rizzolo, Christopher J. Penny, Patrick Watson |
2021-11-02 |
$2,126,000 |
| 11158584 |
Selective CVD alignment-mark topography assist for non-volatile memory |
Michael Rizzolo, Chih-Chao Yang, Lawrence A. Clevenger |
2021-10-26 |
$2,874,000 |
| 11138890 |
Secure access for drone package delivery |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins |
2021-10-05 |
$5,888,000 |
| 11132712 |
Method for using 3D positional spatial olfaction for virtual marketing |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christoper J. Penny, Michael Rizzolo, Aldis Sipolins |
2021-09-28 |
$6,479,000 |
| 11101172 |
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom |
Koichi Motoyama, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger |
2021-08-24 |
$4,861,000 |
| 11081388 |
Forming barrierless contact |
Kisik Choi, Koichi Motoyama, Ashim Dutta, Iqbal Rashid Saraf |
2021-08-03 |
$4,187,000 |
| 11056429 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo |
2021-07-06 |
$22,227,000 |
| 11049744 |
Optimizing semiconductor binning by feed-forward process adjustment |
Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis |
2021-06-29 |
$5,149,000 |
| 11018090 |
Selective CVD alignment-mark topography assist for non-volatile memory |
Michael Rizzolo, Chih-Chao Yang, Lawrence A. Clevenger |
2021-05-25 |
$5,474,000 |
| 11004790 |
Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material |
Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo |
2021-05-11 |
$6,417,000 |
| 10991619 |
Top via process accounting for misalignment by increasing reliability |
Chen Zhang, Lawrence A. Clevenger, Brent A. Anderson, Chih-Chao Yang |
2021-04-27 |
$8,613,000 |
| 10985056 |
Structure and method to improve FAV RIE process margin and Electromigration |
Joe Lee, Theodorus E. Standaert |
2021-04-20 |
$24,642,000 |
| 10978393 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo |
2021-04-13 |
$3,936,000 |
| 10978342 |
Interconnect with self-forming wrap-all-around barrier layer |
Huai Huang, Takeshi Nogami, Alfred Grill, Nicholas Anthony Lanzillo, Christian Lavoie +3 more |
2021-04-13 |
$3,936,000 |
| 10971030 |
Remote physical training |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins |
2021-04-06 |
$3,234,000 |
| 10964588 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2021-03-30 |
$26,023,000 |
| 10957581 |
Self aligned via and pillar cut for at least a self aligned double pitch |
Lawrence A. Clevenger, Michael Rizzolo, Terry A. Spooner, Theodorus E. Standaert |
2021-03-23 |
$2,115,000 |
| 10957646 |
Hybrid BEOL metallization utilizing selective reflection mask |
Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more |
2021-03-23 |
$2,115,000 |
| 10957584 |
Structure and method to improve FAV RIE process margin and electromigration |
Joe Lee, Theodorus E. Standaert |
2021-03-23 |
$27,105,000 |
| 10957582 |
Self aligned via and pillar cut for at least a self aligned double pitch |
Lawrence A. Clevenger, Michael Rizzolo, Terry A. Spooner, Theodorus E. Standaert |
2021-03-23 |
$2,115,000 |
| 10943866 |
Method and structure to construct cylindrical interconnects to reduce resistance |
Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2021-03-09 |
$4,710,000 |
| 10912986 |
Dynamic rigidity mechanism |
Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo |
2021-02-09 |
$3,536,000 |
| 10916501 |
Back end of line electrical fuse structure and method of fabrication |
Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang |
2021-02-09 |
$3,536,000 |
| 10915620 |
Paint on micro chip touch screens |
Maryam Ashoori, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo +1 more |
2021-02-09 |
$3,536,000 |
