| 11210968 |
Behavior-based interactive educational sessions |
Lawrence A. Clevenger, Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin +4 more |
2021-12-28 |
| 11195795 |
Well-controlled edge-to-edge spacing between adjacent interconnects |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-12-07 |
| 11195792 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2021-12-07 |
| 11189568 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-11-30 |
| 11177166 |
Etch stop layer removal for capacitance reduction in damascene top via integration |
Brent A. Anderson, Lawrence A. Clevenger, Robert R. Robison, Kisik Choi, Nicholas Anthony Lanzillo |
2021-11-16 |
| 11177162 |
Trapezoidal interconnect at tight BEOL pitch |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Koichi Motoyama +1 more |
2021-11-16 |
| 11171084 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-11-09 |
| 11164377 |
Motion-controlled portals in virtual reality |
Aldis Sipolins, Lawrence A. Clevenger, Benjamin D. Briggs, Michael Rizzolo, Patrick Watson |
2021-11-02 |
| 11164777 |
Top via with damascene line and via |
Lawrence A. Clevenger, Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2021-11-02 |
| 11158537 |
Top vias with subtractive line formation |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-10-26 |
| 11152299 |
Hybrid selective dielectric deposition for aligned via integration |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Robert R. Robison |
2021-10-19 |
| 11152257 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Robert R. Robison +1 more |
2021-10-19 |
| 11138890 |
Secure access for drone package delivery |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2021-10-05 |
| 11139201 |
Top via with hybrid metallization |
Koichi Motoyama, Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger |
2021-10-05 |
| 11113533 |
Smart display apparatus and control system |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz, Jean Wynne, Jonathan Fry |
2021-09-07 |
| 11062943 |
Top via interconnects with wrap around liner |
Koichi Motoyama, Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger |
2021-07-13 |
| 11056429 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2021-07-06 |
| 11018007 |
Self aligned pattern formation post spacer etchback in tight pitch configurations |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more |
2021-05-25 |
| 11004790 |
Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2021-05-11 |
| 11005646 |
Blockchain stochastic timer transaction synchronization |
Jonathan Fry, James J. Demarest, Marc A. Bergendahl, Jean Wynne, Christopher J. Waskiewicz |
2021-05-11 |
| 10978343 |
Interconnect structure having fully aligned vias |
Chanro Park, Nicholas Anthony Lanzillo, Lawrence A. Clevenger, Balasubramanian Pranatharthiharan |
2021-04-13 |
| 10978393 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Michael Rizzolo |
2021-04-13 |
| 10971030 |
Remote physical training |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2021-04-06 |
| 10964588 |
Selective ILD deposition for fully aligned via with airgap |
Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2021-03-30 |
| 10957583 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2021-03-23 |
