| 11195993 |
Encapsulation topography-assisted self-aligned MRAM top contact |
Nicholas Anthony Lanzillo, Benjamin D. Briggs, Lawrence A. Clevenger |
2021-12-07 |
$3,115,000 |
| 11177437 |
Alignment through topography on intermediate component for memory device patterning |
Hao Tang, Injo Ok, Theodorus E. Standaert |
2021-11-16 |
$1,912,000 |
| 11164779 |
Bamboo tall via interconnect structures |
Chih-Chao Yang, Theodorus E. Standaert |
2021-11-02 |
$2,126,000 |
| 11164377 |
Motion-controlled portals in virtual reality |
Aldis Sipolins, Lawrence A. Clevenger, Benjamin D. Briggs, Christopher J. Penny, Patrick Watson |
2021-11-02 |
$2,126,000 |
| 11158584 |
Selective CVD alignment-mark topography assist for non-volatile memory |
Chih-Chao Yang, Lawrence A. Clevenger, Benjamin D. Briggs |
2021-10-26 |
$2,874,000 |
| 11138890 |
Secure access for drone package delivery |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins |
2021-10-05 |
$5,888,000 |
| 11132712 |
Method for using 3D positional spatial olfaction for virtual marketing |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christoper J. Penny, Aldis Sipolins |
2021-09-28 |
$6,479,000 |
| 11121174 |
MRAM integration into the MOL for fast 1T1M cells |
Alexander Reznicek, Ruilong Xie |
2021-09-14 |
$2,674,000 |
| 11121173 |
Preserving underlying dielectric layer during MRAM device formation |
Ashim Dutta |
2021-09-14 |
$2,674,000 |
| 11081643 |
Bevel metal removal using ion beam etch |
Ashim Dutta, Saba Zare, Theodorus E. Standaert, Daniel C. Edelstein |
2021-08-03 |
$4,187,000 |
| 11074387 |
Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance |
Prasad Bhosale, Chih-Chao Yang |
2021-07-27 |
$4,187,000 |
| 11069854 |
Laser anneal for MRAM encapsulation enhancement |
Oscar van der Straten, Alexander Reznicek, Oleg Gluschenkov |
2021-07-20 |
$5,541,000 |
| 11063089 |
Resistive memory device with meshed electrodes |
Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang |
2021-07-13 |
$4,436,000 |
| 11056429 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2021-07-06 |
$22,227,000 |
| 11049744 |
Optimizing semiconductor binning by feed-forward process adjustment |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert, James H. Stathis |
2021-06-29 |
$5,149,000 |
| 11031250 |
Semiconductor structures of more uniform thickness |
Mona A. Ebrish, Son V. Nguyen, Raghuveer R. Patlolla, Donald F. Canaperi |
2021-06-08 |
$4,452,000 |
| 11031542 |
Contact via with pillar of alternating layers |
Chih-Chao Yang, Daniel C. Edelstein, Theodorus E. Standaert |
2021-06-08 |
$4,452,000 |
| 11018090 |
Selective CVD alignment-mark topography assist for non-volatile memory |
Chih-Chao Yang, Lawrence A. Clevenger, Benjamin D. Briggs |
2021-05-25 |
$5,474,000 |
| 11004735 |
Conductive interconnect having a semi-liner and no top surface recess |
Cornelius Brown Peethala, Oscar van der Straten, Chih-Chao Yang |
2021-05-11 |
$6,417,000 |
| 11004790 |
Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny |
2021-05-11 |
$6,417,000 |
| 10978393 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny |
2021-04-13 |
$3,936,000 |
| 10978388 |
Skip via for metal interconnects |
Hari Prasad Amanapu, Prasad Bhosale, Nicholas V. LiCausi, Lars Liebmann, James Jay McMahon +1 more |
2021-04-13 |
$3,936,000 |
| 10971030 |
Remote physical training |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins |
2021-04-06 |
$3,234,000 |
| 10964588 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2021-03-30 |
$26,023,000 |
| 10957581 |
Self aligned via and pillar cut for at least a self aligned double pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert |
2021-03-23 |
$2,115,000 |
