Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2021-11-16 | $1,912,000 |
| 11145813 | Bottom electrode for semiconductor memory device | Chih-Chao Yang, Theodorus E. Standaert | 2021-10-12 | $3,967,000 |
| 11081643 | Bevel metal removal using ion beam etch | Ashim Dutta, Saba Zare, Michael Rizzolo, Theodorus E. Standaert | 2021-08-03 | $4,187,000 |
| 11056425 | Structural enhancement of Cu nanowires | Chih-Chao Yang | 2021-07-06 | $5,313,000 |
| 11031542 | Contact via with pillar of alternating layers | Chih-Chao Yang, Michael Rizzolo, Theodorus E. Standaert | 2021-06-08 | $4,452,000 |
| 10892404 | Sacrificial buffer layer for metal removal at a bevel edge of a substrate | Ashim Dutta, Saba Zare, Michael Rizzolo, Theodorus E. Standaert | 2021-01-12 | $3,912,000 |