Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189528 | Subtractive RIE interconnect | John C. Arnold, Balasubramanian S. Pranatharthi Haran | 2021-11-30 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Vamsi K. Paruchuri +2 more | 2021-11-16 |
| 11164776 | Metallic interconnect structure | Son V. Nguyen, Thomas J. Haigh, Jr., Cornelius Brown Peethala, Matthew T. Shoudy | 2021-11-02 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo, Christian Lavoie +3 more | 2021-04-13 |
| 10978393 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Michael Rizzolo | 2021-04-13 |