Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11186911 | Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same | Son V. Nguyen, Deepika Priyadarshini | 2021-11-30 | $2,996,000 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2021-11-16 | $1,912,000 |
| 11066748 | Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same | Son V. Nguyen, Deepika Priyadarshini | 2021-07-20 | $5,541,000 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Benjamin D. Briggs, Nicholas Anthony Lanzillo, Christian Lavoie +3 more | 2021-04-13 | $3,936,000 |