| 11195792 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-12-07 |
| 11195993 |
Encapsulation topography-assisted self-aligned MRAM top contact |
Michael Rizzolo, Benjamin D. Briggs, Lawrence A. Clevenger |
2021-12-07 |
| 11195795 |
Well-controlled edge-to-edge spacing between adjacent interconnects |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-12-07 |
| 11189568 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-11-30 |
| 11177162 |
Trapezoidal interconnect at tight BEOL pitch |
Hosadurga Shobha, Huai Huang, Junli Wang, Koichi Motoyama, Christopher J. Penny +1 more |
2021-11-16 |
| 11177170 |
Removal of barrier and liner layers from a bottom of a via |
Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng |
2021-11-16 |
| 11177166 |
Etch stop layer removal for capacitance reduction in damascene top via integration |
Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Robert R. Robison, Kisik Choi |
2021-11-16 |
| 11171084 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-11-09 |
| 11164777 |
Top via with damascene line and via |
Lawrence A. Clevenger, Brent A. Anderson, Kisik Choi, Christopher J. Penny, Robert R. Robison |
2021-11-02 |
| 11158537 |
Top vias with subtractive line formation |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-10-26 |
| 11152299 |
Hybrid selective dielectric deposition for aligned via integration |
Christopher J. Penny, Hosadurga Shobha, Lawrence A. Clevenger, Robert R. Robison |
2021-10-19 |
| 11152257 |
Barrier-less prefilled via formation |
Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny, Robert R. Robison +1 more |
2021-10-19 |
| 11139201 |
Top via with hybrid metallization |
Koichi Motoyama, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger |
2021-10-05 |
| 11062943 |
Top via interconnects with wrap around liner |
Koichi Motoyama, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger |
2021-07-13 |
| 11049744 |
Optimizing semiconductor binning by feed-forward process adjustment |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis |
2021-06-29 |
| 10978342 |
Interconnect with self-forming wrap-all-around barrier layer |
Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Christian Lavoie +3 more |
2021-04-13 |
| 10978393 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo |
2021-04-13 |
| 10978343 |
Interconnect structure having fully aligned vias |
Chanro Park, Christopher J. Penny, Lawrence A. Clevenger, Balasubramanian Pranatharthiharan |
2021-04-13 |
| 10886166 |
Dielectric surface modification in sub-40nm pitch interconnect patterning |
Chih-Chao Yang |
2021-01-05 |
