| 11210968 |
Behavior-based interactive educational sessions |
Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin, Bryan Gury +4 more |
2021-12-28 |
$7,175,000 |
| 11199505 |
Machine learning enhanced optical-based screening for in-line wafer testing |
Robin Hsin Kuo Chao, Mary Breton, Huai Huang, Dexin Kong |
2021-12-14 |
$4,192,000 |
| 11195792 |
Top via stack |
Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison |
2021-12-07 |
$3,115,000 |
| 11195993 |
Encapsulation topography-assisted self-aligned MRAM top contact |
Michael Rizzolo, Nicholas Anthony Lanzillo, Benjamin D. Briggs |
2021-12-07 |
$3,115,000 |
| 11195795 |
Well-controlled edge-to-edge spacing between adjacent interconnects |
Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-12-07 |
$3,115,000 |
| 11189568 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-11-30 |
$2,996,000 |
| 11189566 |
Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias |
Dongbing Shao, Shyng-Tsong Chen, Hao Tang, Jing Sha |
2021-11-30 |
$2,996,000 |
| 11185658 |
Internet of things (IOT) real-time response to defined symptoms |
Mahmoud Amin, Krishna R. Tunga, Zhenxing Bi, Leigh Anne H. Clevenger |
2021-11-30 |
$2,996,000 |
| 11182722 |
Cognitive system for automatic risk assessment, solution identification, and action enablement |
Alex Richard Hubbard, Spyridon Skordas, Marc A. Bergendahl, Cody J. Murray, Gauri Karve |
2021-11-23 |
$2,653,000 |
| 11177162 |
Trapezoidal interconnect at tight BEOL pitch |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Koichi Motoyama +1 more |
2021-11-16 |
$1,912,000 |
| 11177166 |
Etch stop layer removal for capacitance reduction in damascene top via integration |
Christopher J. Penny, Brent A. Anderson, Robert R. Robison, Kisik Choi, Nicholas Anthony Lanzillo |
2021-11-16 |
$1,912,000 |
| 11177217 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more |
2021-11-16 |
$1,912,000 |
| 11171063 |
Metalization repair in semiconductor wafers |
Baozhen Li, Kirk D. Peterson, John E. Sheets, II |
2021-11-09 |
$5,376,000 |
| 11171084 |
Top via with next level line selective growth |
Brent A. Anderson, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison |
2021-11-09 |
$5,376,000 |
| 11171064 |
Metalization repair in semiconductor wafers |
Baozhen Li, Kirk D. Peterson, John E. Sheets, II |
2021-11-09 |
$5,376,000 |
| 11171001 |
Multiple patterning scheme integration with planarized cut patterning |
Hsueh-Chung Chen, Yongan Xu, Yann Mignot, Cornelius Brown Peethala |
2021-11-09 |
$5,376,000 |
| 11164777 |
Top via with damascene line and via |
Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison |
2021-11-02 |
$2,126,000 |
| 11164778 |
Barrier-free vertical interconnect structure |
Junli Wang, Hsueh-Chung Chen, Su Chen Fan, Yann Mignot |
2021-11-02 |
$2,126,000 |
| 11164817 |
Multi-chip package structures with discrete redistribution layers |
Joshua M. Rubin, Kamal K. Sikka, Steven L. Wright |
2021-11-02 |
$2,126,000 |
| 11164377 |
Motion-controlled portals in virtual reality |
Aldis Sipolins, Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Patrick Watson |
2021-11-02 |
$2,126,000 |
| 11163932 |
Semiconductor process modeling to enable skip via in place and route flow |
Dongbing Shao, Zheng Xu |
2021-11-02 |
$2,126,000 |
| 11154628 |
Self-sterilizing sensor |
Kangguo Cheng, Shawn P. Fetterolf, Donald F. Canaperi |
2021-10-26 |
$2,874,000 |
| 11158537 |
Top vias with subtractive line formation |
Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison |
2021-10-26 |
$2,874,000 |
| 11158584 |
Selective CVD alignment-mark topography assist for non-volatile memory |
Michael Rizzolo, Chih-Chao Yang, Benjamin D. Briggs |
2021-10-26 |
$2,874,000 |
| 11152299 |
Hybrid selective dielectric deposition for aligned via integration |
Nicholas Anthony Lanzillo, Christopher J. Penny, Hosadurga Shobha, Robert R. Robison |
2021-10-19 |
$2,168,000 |
