Issued Patents 2021
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11210968 | Behavior-based interactive educational sessions | Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin, Bryan Gury +4 more | 2021-12-28 |
| 11199505 | Machine learning enhanced optical-based screening for in-line wafer testing | Robin Hsin Kuo Chao, Mary Breton, Huai Huang, Dexin Kong | 2021-12-14 |
| 11195792 | Top via stack | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2021-12-07 |
| 11195993 | Encapsulation topography-assisted self-aligned MRAM top contact | Michael Rizzolo, Nicholas Anthony Lanzillo, Benjamin D. Briggs | 2021-12-07 |
| 11195795 | Well-controlled edge-to-edge spacing between adjacent interconnects | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2021-12-07 |
| 11189568 | Top via interconnect having a line with a reduced bottom dimension | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2021-11-30 |
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Dongbing Shao, Shyng-Tsong Chen, Hao Tang, Jing Sha | 2021-11-30 |
| 11185658 | Internet of things (IOT) real-time response to defined symptoms | Mahmoud Amin, Krishna R. Tunga, Zhenxing Bi, Leigh Anne H. Clevenger | 2021-11-30 |
| 11182722 | Cognitive system for automatic risk assessment, solution identification, and action enablement | Alex Richard Hubbard, Spyridon Skordas, Marc A. Bergendahl, Cody J. Murray, Gauri Karve | 2021-11-23 |
| 11177162 | Trapezoidal interconnect at tight BEOL pitch | Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Koichi Motoyama +1 more | 2021-11-16 |
| 11177166 | Etch stop layer removal for capacitance reduction in damascene top via integration | Christopher J. Penny, Brent A. Anderson, Robert R. Robison, Kisik Choi, Nicholas Anthony Lanzillo | 2021-11-16 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11171063 | Metalization repair in semiconductor wafers | Baozhen Li, Kirk D. Peterson, John E. Sheets, II | 2021-11-09 |
| 11171084 | Top via with next level line selective growth | Brent A. Anderson, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison | 2021-11-09 |
| 11171064 | Metalization repair in semiconductor wafers | Baozhen Li, Kirk D. Peterson, John E. Sheets, II | 2021-11-09 |
| 11171001 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Yann Mignot, Cornelius Brown Peethala | 2021-11-09 |
| 11164777 | Top via with damascene line and via | Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison | 2021-11-02 |
| 11164778 | Barrier-free vertical interconnect structure | Junli Wang, Hsueh-Chung Chen, Su Chen Fan, Yann Mignot | 2021-11-02 |
| 11164817 | Multi-chip package structures with discrete redistribution layers | Joshua M. Rubin, Kamal K. Sikka, Steven L. Wright | 2021-11-02 |
| 11164377 | Motion-controlled portals in virtual reality | Aldis Sipolins, Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Patrick Watson | 2021-11-02 |
| 11163932 | Semiconductor process modeling to enable skip via in place and route flow | Dongbing Shao, Zheng Xu | 2021-11-02 |
| 11154628 | Self-sterilizing sensor | Kangguo Cheng, Shawn P. Fetterolf, Donald F. Canaperi | 2021-10-26 |
| 11158537 | Top vias with subtractive line formation | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2021-10-26 |
| 11158584 | Selective CVD alignment-mark topography assist for non-volatile memory | Michael Rizzolo, Chih-Chao Yang, Benjamin D. Briggs | 2021-10-26 |
| 11152299 | Hybrid selective dielectric deposition for aligned via integration | Nicholas Anthony Lanzillo, Christopher J. Penny, Hosadurga Shobha, Robert R. Robison | 2021-10-19 |