Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205035 | Bump connection placement in quantum devices in a flip chip configuration | Markus Brink | 2021-12-21 |
| 11195982 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Markus Brink, Firat Solgun, Jared Barney Hertzberg | 2021-12-07 |
| 11195799 | Hybrid readout package for quantum multichip bonding | Eric P. Lewandowski, Nicholas Torleiv Bronn, Markus Brink | 2021-12-07 |
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Lawrence A. Clevenger, Shyng-Tsong Chen, Hao Tang, Jing Sha | 2021-11-30 |
| 11163932 | Semiconductor process modeling to enable skip via in place and route flow | Zheng Xu, Lawrence A. Clevenger | 2021-11-02 |
| 11165248 | Air gap metal tip electrostatic discharge protection | Qianwen Chen, Yang Liu, Zheng Xu | 2021-11-02 |
| 11133670 | Air gap metal tip electrostatic discharge protection | Qianwen Chen, Yang Liu, Zheng Xu | 2021-09-28 |
| 11062911 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Robert C. Wong, Yongan Xu | 2021-07-13 |
| 11038093 | Wirebond cross-talk reduction for quantum computing chips | Markus Brink | 2021-06-15 |
| 11036126 | Semiconductor fabrication design rule loophole checking for design for manufacturability optimization | Chieh-Yu Lin, Kehan Tian, Zheng Xu | 2021-06-15 |
| 10950545 | Circuit wiring techniques for stacked transistor structures | Chen Zhang, Zheng Xu, Tenko Yamashita | 2021-03-16 |
| 10936782 | Semiconductor process modeling to enable skip via in place and route flow | Zheng Xu, Lawrence A. Clevenger | 2021-03-02 |
| 10915690 | Via design optimization to improve via resistance | Yongan Xu, Shyng-Tsong Chen, Zheng Xu | 2021-02-09 |
| 10903412 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Markus Brink, Firat Solgun, Jared Barney Hertzberg | 2021-01-26 |