| 11189532 |
Dual width finned semiconductor structure |
Yi Song, Jay William Strane, Eric R. Miller, Richard A. Conti |
2021-11-30 |
$2,996,000 |
| 11127815 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Eric R. Miller, Robert R. Robison, John R. Sporre +1 more |
2021-09-21 |
$21,372,000 |
| 11081424 |
Micro-fluidic channels having various critical dimensions |
Ravi K. Bonam, Kamal K. Sikka, Joshua M. Rubin, Iqbal Rashid Saraf |
2021-08-03 |
$4,187,000 |
| 11079337 |
Secure wafer inspection and identification |
Effendi Leobandung, Richard C. Johnson, Scott D. Halle, Robin Hsin Kuo Chao |
2021-08-03 |
$4,187,000 |
| 11075299 |
Transistor gate having tapered segments positioned above the fin channel |
Eric R. Miller, Gauri Karve, Marc A. Bergendahl, Kangguo Cheng, Sean Teehan |
2021-07-27 |
$4,187,000 |
| 11062911 |
Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic |
Dongbing Shao, Robert C. Wong, Yongan Xu |
2021-07-13 |
$21,953,000 |
| 11056418 |
Semiconductor microcooler |
Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Kamal K. Sikka |
2021-07-06 |
$5,313,000 |
| 11049789 |
Semiconductor microcooler |
Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Kamal K. Sikka |
2021-06-29 |
$5,149,000 |
| 11043494 |
Structure and method for equal substrate to channel height between N and P fin-FETs |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Deepika Priyadarshini +2 more |
2021-06-22 |
$6,016,000 |
| 11043581 |
Nanosheet channel-to-source and drain isolation |
Marc A. Bergendahl, Kangguo Cheng, Eric R. Miller, John R. Sporre, Sean Teehan |
2021-06-22 |
$24,296,000 |
| 11031346 |
Advanced wafer security method including pattern and wafer verifications |
Effendi Leobandung, Carol Boye, Shravan Kumar Matham, Brad Austin |
2021-06-08 |
$4,452,000 |
| 10937867 |
Conformal doping for punch through stopper in fin field effect transistor devices |
Huiming Bu, Sivananda K. Kanakasabapathy, Tenko Yamashita |
2021-03-02 |
$2,720,000 |
| 10937810 |
Sub-fin removal for SOI like isolation with uniform active fin height |
Marc A. Bergendahl, Kangguo Cheng, Gauri Karve, Eric R. Miller, John R. Sporre +1 more |
2021-03-02 |
$2,720,000 |
| 10937764 |
Three-dimensional microelectronic package with embedded cooling channels |
Kamal K. Sikka, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more |
2021-03-02 |
$2,720,000 |
| 10886271 |
Fabrication of fin field effect transistors for complementary metal oxide semiconductor devices including separate n-type and p-type source/drains using a single spacer deposition |
Kangguo Cheng, Eric R. Miller, Sean Teehan |
2021-01-05 |
$2,293,000 |
