HB

Huiming Bu

IBM: 5 patents #1,142 of 11,638Top 10%
TE Tessera: 2 patents #11 of 70Top 20%
Overall (2021): #17,090 of 548,734Top 4%
7
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11189729 Forming a sacrificial liner for dual channel devices Kangguo Cheng, Dechao Guo, Sivananda K. Kanakasabapathy, Peng Xu 2021-11-30
11139385 Interface-less contacts to source/drain regions and gate electrode over active portion of device Junli Wang, Veeraraghavan S. Basker 2021-10-05
11094824 Forming a sacrificial liner for dual channel devices Kangguo Cheng, Dechao Guo, Sivananda K. Kanakasabapathy, Peng Xu 2021-08-17
11088278 Precise junction placement in vertical semiconductor devices using etch stop layers Liying Jiang, Siyuranga O. Koswatta, Junli Wang 2021-08-10
11011513 Integrating a junction field effect transistor into a vertical field effect transistor Brent A. Anderson, Terence B. Hook, Xuefeng Liu, Junli Wang 2021-05-18
10937867 Conformal doping for punch through stopper in fin field effect transistor devices Sivananda K. Kanakasabapathy, Fee Li Lie, Tenko Yamashita 2021-03-02
10892181 Semiconductor device with mitigated local layout effects Huimei Zhou, Gen Tsutsui, Veeraraghavan S. Basker, Andrew M. Greene, Dechao Guo +1 more 2021-01-12