Dinesh Gupta — 6 Patents at IBM

Issued Patents 2021

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11177217	Direct bonded heterogeneous integration packaging structures	Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Charles L. Arvin +5 more	2021-11-16	$1,912,000
11056418	Semiconductor microcooler	Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka	2021-07-06	$5,313,000
11049789	Semiconductor microcooler	Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka	2021-06-29	$5,149,000
11049844	Semiconductor wafer having trenches with varied dimensions for multi-chip modules	Ravi K. Bonam, Mukta G. Farooq, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin	2021-06-29	$5,149,000
10943883	Planar wafer level fan-out of multi-chip modules having different size chips	Ravi K. Bonam, Mukta G. Farooq, James J. Kelly	2021-03-09	$4,710,000
10937764	Three-dimensional microelectronic package with embedded cooling channels	Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more	2021-03-02	$2,720,000