Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Charles L. Arvin +5 more | 2021-11-16 |
| 11056418 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2021-07-06 |
| 11049789 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2021-06-29 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Ravi K. Bonam, Mukta G. Farooq, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin | 2021-06-29 |
| 10943883 | Planar wafer level fan-out of multi-chip modules having different size chips | Ravi K. Bonam, Mukta G. Farooq, James J. Kelly | 2021-03-09 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2021-03-02 |