Daniel A. Corliss — 7 Patents at IBM

Issued Patents 2021

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11177130	Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography	Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix, Rudy J. Wojtecki	2021-11-16	$1,912,000
11056418	Semiconductor microcooler	Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka	2021-07-06	$5,313,000
11049789	Semiconductor microcooler	Donald F. Canaperi, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka	2021-06-29	$5,149,000
11037786	Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography	Ekmini Anuja De Silva, Dario L. Goldfarb, Nelson Felix, Rudy J. Wojtecki	2021-06-15	$4,393,000
10937764	Three-dimensional microelectronic package with embedded cooling channels	Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more	2021-03-02	$2,720,000
10921715	Semiconductor structure for optical validation	Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf	2021-02-16	$7,591,000
10921716	Lithographic dose characterization	Christopher F. Robinson	2021-02-16	$7,591,000