| 11205678 |
Embedded MRAM device with top via |
Ashim Dutta, Dominik Metzler |
2021-12-21 |
$5,237,000 |
| 11199778 |
Polymer brush adhesion promoter with UV cleavable linker |
Jing Guo, Bharat Kumar, Jennifer Church, Dario L. Goldfarb, Nelson Felix |
2021-12-14 |
$4,192,000 |
| 11195995 |
Back-end-of-line compatible processing for forming an array of pillars |
Chi-Chun Liu, Yann Mignot, Nelson Felix, John C. Arnold |
2021-12-07 |
$3,115,000 |
| 11194254 |
Lithography process delay characterization and effective dose compensation |
Christopher F. Robinson, Luciana Meli, Cody J. Murray |
2021-12-07 |
$3,115,000 |
| 11187983 |
EUV patterning of monolayers for selective atomic layer deposition |
Rudy J. Wojtecki, Noel Arellano, Noah Frederick Fine Nathel |
2021-11-30 |
$2,996,000 |
| 11189561 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric |
Ashim Dutta, Dominik Metzler, John C. Arnold |
2021-11-30 |
$2,996,000 |
| 11177130 |
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography |
Dario L. Goldfarb, Nelson Felix, Daniel A. Corliss, Rudy J. Wojtecki |
2021-11-16 |
$1,912,000 |
| 11164772 |
Spacer-defined process for lithography-etch double patterning for interconnects |
Nelson Felix, Luciana Meli Thompson, Yann Mignot |
2021-11-02 |
$2,126,000 |
| 11133189 |
Metal cut patterning and etching to minimize interlayer dielectric layer loss |
Kisup Chung, Andrew M. Greene, Siva Kanakasabapathy, Indira Seshadri |
2021-09-28 |
$6,479,000 |
| 11133195 |
Inverse tone pillar printing method using polymer brush grafts |
Nelson Felix, Praveen Joseph, Ashim Dutta |
2021-09-28 |
$6,479,000 |
| 11131919 |
Extreme ultraviolet (EUV) mask stack processing |
Yongan Xu, Zhenxing Bi, Yann Mignot, Nelson Felix |
2021-09-28 |
$6,479,000 |
| 11121024 |
Tunable hardmask for overlayer metrology contrast |
Nelson Felix, Indira Seshadri, Stuart A. Sieg |
2021-09-14 |
$2,674,000 |
| 11081566 |
Self-aligned contacts for vertical field effect transistors |
Su Chen Fan, Sivananda K. Kanakasabapathy |
2021-08-03 |
$4,187,000 |
| 11075266 |
Vertically stacked fin semiconductor devices |
Praveen Joseph, Tao Li, Indira Seshadri |
2021-07-27 |
$4,187,000 |
| 11075081 |
Semiconductor device with multiple threshold voltages |
Praveen Joseph, Indira Seshadri |
2021-07-27 |
$4,187,000 |
| 11067896 |
Dynamic adjustment of post exposure bake during lithography utilizing real-time feedback for wafer exposure delay |
Cody J. Murray, Alex Richard Hubbard, Karen E. Petrillo, Nelson Felix |
2021-07-20 |
$5,541,000 |
| 11062946 |
Self-aligned contact on a semiconductor device |
Ashim Dutta, Jennifer Church, Luciana Meli Thompson |
2021-07-13 |
$4,436,000 |
| 11043628 |
Multi-layer bottom electrode for embedded memory devices |
Ashim Dutta |
2021-06-22 |
$6,016,000 |
| 11037786 |
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography |
Dario L. Goldfarb, Nelson Felix, Daniel A. Corliss, Rudy J. Wojtecki |
2021-06-15 |
$4,393,000 |
| 11022887 |
Tunable adhesion of EUV photoresist on oxide surface |
Yongan Xu, Jing Guo, Oleg Gluschenkov |
2021-06-01 |
$4,052,000 |
| 10998191 |
Graded hardmask interlayer for enhanced extreme ultraviolet performance |
Jennifer Church, Dario L. Goldfarb |
2021-05-04 |
$7,263,000 |
| 10998192 |
Sequential infiltration synthesis extreme ultraviolet single expose patterning |
Jing Guo, Luciana Meli, Nelson Felix |
2021-05-04 |
$7,263,000 |
| 10975464 |
Hard mask films with graded vertical concentration formed using reactive sputtering in a radio frequency deposition chamber |
Yongan Xu, Abraham Arceo de la Pena, Chih-Chao Yang |
2021-04-13 |
$3,936,000 |
| 10957552 |
Extreme ultraviolet lithography patterning with directional deposition |
Yongan Xu, Su Chen Fan, Yann Mignot |
2021-03-23 |
$2,115,000 |
| 10950440 |
Patterning directly on an amorphous silicon hardmask |
Abraham Arceo de la Pena, Nelson Felix |
2021-03-16 |
$6,230,000 |
