KC

Kisup Chung

IBM: 3 patents #2,072 of 11,638Top 20%
TE Tessera: 1 patents #27 of 70Top 40%
Overall (2021): #45,963 of 548,734Top 9%
4
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11152489 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Andrew M. Greene, Sivananda K. Kanakasabapathy, David L. Rath, Indira Seshadri +1 more 2021-10-19
11133189 Metal cut patterning and etching to minimize interlayer dielectric layer loss Ekmini Anuja De Silva, Andrew M. Greene, Siva Kanakasabapathy, Indira Seshadri 2021-09-28
11075281 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Andrew M. Greene, Sivananda K. Kanakasabapathy, David L. Rath, Indira Seshadri +1 more 2021-07-27
10978550 Efficient metal-insulator-metal capacitor Isabel C. Estrada-Raygoza, Hemanth Jagannathan, Chi-Chun Liu, Yann Mignot, Hao Tang 2021-04-13