Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171002 | Alternating hardmasks for tight-pitch line formation | John C. Arnold, Anuja E. DeSilva, Nelson Felix, Chi-Chun Liu, Stuart A. Sieg | 2021-11-09 |
| 11164772 | Spacer-defined process for lithography-etch double patterning for interconnects | Nelson Felix, Ekmini Anuja De Silva, Luciana Meli Thompson | 2021-11-02 |
| 11075161 | Large via buffer | Hsueh-Chung Chen, Junli Wang, Chi-Chun Liu, Mary Claire Silvestre | 2021-07-27 |
| 11031248 | Alternating hardmasks for tight-pitch line formation | Sean D. Burns, Nelson Felix, Chi-Chun Liu, Stuart A. Sieg | 2021-06-08 |
| 10978576 | Techniques for vertical FET gate length control | Chi-Chun Liu, Chun Wing Yeung, Robin Hsin Kuo Chao, Zhenxing Bi, Kristin Schmidt | 2021-04-13 |
| 10978550 | Efficient metal-insulator-metal capacitor | Kisup Chung, Isabel C. Estrada-Raygoza, Hemanth Jagannathan, Chi-Chun Liu, Hao Tang | 2021-04-13 |
| 10957583 | Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs | Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2021-03-23 |